Another challenge was recording and storing the measured data. Complex additional modules, such as solid-state drives (SSDs) with high storage capacity, were out of the question for reasons of space and cost. Without compression, the data already has a storage requirement of one megabyte for a relatively short journey. However, a method developed within this project makes it possible to compress the obtained data in such a way that the temperature profile of even extensive journeys can be transferred to EEPROM with 8 kilobytes of storage.
The thermal load profiles thus obtained with different test drivers or car models can subsequently be evaluated. In this way the new process lays the foundation for simulations with which we can optimize the dimensioning of semiconductors in power electronics.